The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2022

Filed:

Sep. 03, 2018
Applicants:

Kabushiki Kaisha Toyota Jidoshokki, Kariya, JP;

Toyota Jidosha Kabushiki Kaisha, Toyota, JP;

Inventors:

Tomohiro Nakamura, Kariya, JP;

Yuki Chujo, Kariya, JP;

Masahiro Yamada, Kariya, JP;

Takayuki Hirose, Kariya, JP;

Nobuyasu Haga, Seto, JP;

Motoyoshi Okumura, Nagoya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 11/28 (2013.01); H01M 10/04 (2006.01); H01M 50/183 (2021.01); H01M 4/02 (2006.01);
U.S. Cl.
CPC ...
H01G 11/28 (2013.01); H01M 10/0418 (2013.01); H01M 50/183 (2021.01); H01M 2004/029 (2013.01); H01M 2220/20 (2013.01);
Abstract

A power storage module includes an electrode laminate in which bipolar electrodes are laminated and a sealing body formed of a resin. The bipolar electrode includes an electrode plate, a positive electrode provided on one surface of the electrode plate, and a negative electrode provided on another surface of the electrode plate. The sealing body is provided on a side surface of the electrode laminate to surround an edge portion of the bipolar electrode. The sealing body includes a first resin portion and a second resin portion. The first resin portion is welded to the edge portion of the bipolar electrode. The second resin portion surrounds the first resin portion from an outer side along the side surface. A mold shrinkage factor of the first resin portion is lower than a mold shrinkage factor of the second resin portion.


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