The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2022

Filed:

May. 01, 2020
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Je Jung Kim, Suwon-si, KR;

Seung Ryeol Lee, Suwon-si, KR;

Ji Won Lee, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/012 (2006.01); H01G 2/06 (2006.01); H01G 4/008 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); H01G 2/065 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1218 (2013.01);
Abstract

A multilayer electronic component includes a body, a protrusion disposed on at least one surface of the body, and an external electrode having an electrode layer disposed on a side surface of the body and extending to be in contact with a side surface of the protrusion and a conductive resin layer disposed on the electrode layer and extending to cover a portion of the protrusion.


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