The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2022

Filed:

Sep. 30, 2019
Applicant:

Itron Global Sarl, Liberty Lake, WA (US);

Inventors:

Abbas Sabraoui, Liberty Lake, WA (US);

Michel Bottner, Liberty Lake, WA (US);

Daniel Catherin, Liberty Lake, WA (US);

Assignee:

Itron Global SARL, Liberty Lake, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01D 11/24 (2006.01); G01F 1/66 (2022.01); G01F 15/14 (2006.01); H04R 1/02 (2006.01); G01N 29/22 (2006.01); G01N 29/24 (2006.01);
U.S. Cl.
CPC ...
G01F 1/662 (2013.01); G01D 11/245 (2013.01); G01F 15/14 (2013.01); G01N 29/222 (2013.01); G01N 29/227 (2013.01); H04R 1/02 (2013.01); G01N 29/223 (2013.01); G01N 29/2437 (2013.01);
Abstract

A plug is adapted for connection to an ultrasonic transducer to protect and guide wiring during storage, transportation, and the manufacturing process. The plug protects and orients wires to allow for automated manufacturing and to provide an improved connection between the transducer and an electronic printed circuit board. The plug may include a first portion having wire guide(s) and a second portion configured for attachment to the transducer. The plug includes at least one wire guide to protect wire(s) that connect the ultrasonic transducer to a printed circuit board. A wire extends through a passage defined in each wire guide on a first portion of the plug. The first portion slides with respect to the second portion to expose portions of first and second wires carried within the first and second channels, respectively. Once exposed, the wires can be soldered to a PCB in an automated manner.


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