The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2022
Filed:
Nov. 20, 2018
Applicant:
City University of Hong Kong, Kowlonn, HK;
Inventors:
Assignee:
City University of Hong Kong, Kowloon, HK;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 30/00 (2006.01); C22F 1/16 (2006.01); C22C 1/02 (2006.01);
U.S. Cl.
CPC ...
C22C 30/00 (2013.01); C22C 1/02 (2013.01); C22F 1/16 (2013.01);
Abstract
A method for preparing a high entropy alloy (HEA) structure includes the steps of: preparing an alloy by arc melting raw materials comprising five or more elements; drop casting the melted alloy into a cooled mold to form a bulk alloy with eutectic microstructure therein; and subjecting the bulk alloy to an acidic condition to form a bulk porous structure with eutectic microstructure therein. A high entropy alloy structure is also provided as prepared by the method.