The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2022

Filed:

Oct. 18, 2019
Applicants:

University of Science & Technology Beijing, Beijing, CN;

Dongguan Yongtao New Material Technology Co., Ltd., Dongguan, CN;

Inventors:

Yong Zhang, Beijing, CN;

Ruixuan Li, Beijing, CN;

Tao Zhang, Beijing, CN;

Yangde Li, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 21/10 (2006.01); C22C 1/02 (2006.01); C22C 1/03 (2006.01);
U.S. Cl.
CPC ...
C22C 21/10 (2013.01); C22C 1/026 (2013.01); C22C 1/03 (2013.01);
Abstract

A 1 GPa high-strength high-modulus aluminum-based light medium-entropy alloy and a preparation method thereof. An atomic expression of the designed medium-entropy alloy is AlLiMgZnCu, subscripts representing the molar percentage of each corresponding alloy element, where x+y+z+u+v=100, x is 79.5-80.5, y is 1.5-2.5, z is 1.5-2.5, u is 13.5-14.5, and v is 1.5-2.5. The phase structure of the involved alloy is mainly based on a face-centered cubic (FCC) solid solution. The present invention obtains high performance aluminum alloy ingots through vacuum induction smelting and direct casting, and features low energy consumption, decreased cost, and simple operation in the preparation process, which cater to the high requirements on cost, strength and plasticity of light alloys applied in the high-end manufacturing industries such as aerospace and automobile electronics nowadays.


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