The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2022

Filed:

Jan. 08, 2020
Applicants:

Te Connectivity Services Gmbh, Schaffhausen, CH;

Te Connectivity Germany Gmbh, Bensheim, DE;

Inventors:

Dejie Tao, Fremont, CA (US);

Lei Wang, San Jose, CA (US);

Yiliang Wu, San Ramon, CA (US);

Ting Gao, Palo Alto, CA (US);

Andre Martin Dressel, Lampertheim, DE;

Marco Wolf, Hochstadt, DE;

Mei Dong, College Station, TX (US);

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/08 (2006.01); B32B 27/28 (2006.01); C08L 83/04 (2006.01); B32B 27/08 (2006.01); C08K 3/36 (2006.01); C08K 3/22 (2006.01); C08K 3/26 (2006.01); H01M 50/143 (2021.01); H01M 50/24 (2021.01);
U.S. Cl.
CPC ...
C08L 83/04 (2013.01); B32B 15/08 (2013.01); B32B 27/08 (2013.01); B32B 27/283 (2013.01); B32B 2307/206 (2013.01); C08K 3/36 (2013.01); C08K 2003/2206 (2013.01); C08K 2003/2224 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/267 (2013.01); H01M 50/143 (2021.01); H01M 50/24 (2021.01);
Abstract

A silicone composite for high temperature insulation applications is disclosed. The composite is formed of a silicone and a thermally decomposable inorganic filler which are compounded together. The compounded material is then injection molded, overmolded, compression molded, cast, laminated, extruded, or dispensed. When the silicone composite is exposed to a high temperature, it forms an inorganic composite and maintains its insulating properties and dimensional stability.


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