The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2022
Filed:
Jun. 26, 2018
Applicant:
Qinetiq Limited, Hampshire, GB;
Inventors:
Andrew David Foreman, Aldershot, GB;
Charlotte Bree Meeks, Farnborough, GB;
Robert West, Farnborough, GB;
Assignee:
QINETIQ LIMITED, Hampshire, GB;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29B 11/00 (2006.01); B32B 5/00 (2006.01); B29B 11/16 (2006.01); B32B 5/26 (2006.01); B29C 70/24 (2006.01); B32B 5/02 (2006.01); D03D 25/00 (2006.01);
U.S. Cl.
CPC ...
B29B 11/16 (2013.01); B32B 5/26 (2013.01); B29C 70/24 (2013.01); B32B 5/024 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2262/106 (2013.01); B32B 2307/558 (2013.01); B32B 2605/18 (2013.01); D03D 25/005 (2013.01);
Abstract
Some embodiments are directed to a three-dimensional (3D) preform including reinforcing fibres and shape memory alloys (SMA) wires and a composite material including a polymer matrix with a 3D-preform embedded therein, wherein the 3D-preform includes reinforcing fibres and shape memory alloy (SMA) wires.