The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2022
Filed:
Jun. 11, 2019
Applicant:
Protec Co., Ltd., Gyeonggi-do, KR;
Inventor:
Geunsik Ahn, Seoul, KR;
Assignee:
PROTEC CO., LTD., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 11/00 (2006.01); B23K 26/12 (2014.01); H01L 23/00 (2006.01); H01L 21/50 (2006.01); B23K 26/066 (2014.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
B23K 26/1224 (2015.10); B23K 26/066 (2015.10); H01L 21/50 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 2021/60112 (2013.01); H01L 2021/60292 (2013.01); H01L 2224/75263 (2013.01); H01L 2224/81203 (2013.01); H01L 2225/06513 (2013.01);
Abstract
Provided is a mask changing unit for a laser bonding apparatus, and more particularly, a mask changing unit for a laser bonding apparatus, wherein the mask changing unit supplies or changes a mask to or in the laser bonding apparatus for bonding a semiconductor chip to a substrate by using a laser beam. The mask changing unit for a laser bonding apparatus, a plurality of masks that are used in performing laser bonding of a semiconductor chip to a substrate while the semiconductor chip is being pressed may be easily supplied to the laser bonding apparatus or changed in the laser bonding apparatus.