The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2022

Filed:

Jun. 11, 2020
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Hyunjoong Yoon, Suwon-si, KR;

Myunghoon Kwak, Suwon-si, KR;

Minki Park, Suwon-si, KR;

Youngjae You, Suwon-si, KR;

Yongsang Yun, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H05K 7/20 (2006.01); H01L 23/40 (2006.01); H05K 1/02 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0022 (2013.01); H01L 23/4006 (2013.01); H01L 23/552 (2013.01); H05K 1/0203 (2013.01); H05K 7/2049 (2013.01); H05K 7/20336 (2013.01); H05K 7/20472 (2013.01); H05K 7/20509 (2013.01); H05K 9/0032 (2013.01); H05K 9/0024 (2013.01);
Abstract

An electronic device having a shielding structure disposed around electronic components and having high heat dissipation performance is provided. The electronic device includes a circuit board, at least one electronic component mounted on a surface of the circuit board, a shielding sheet attached to the surface of the circuit board to cover the at least one electronic component, a thermal interface material stacked on the shielding sheet to overlap the at least one electronic component, and a heat dissipation member disposed to face the surface of the circuit board, being in surface contact with the thermal interface material, and fastened to at least a portion of the circuit board by a fixing member. Various other embodiments may be possible.


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