The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2022

Filed:

Oct. 18, 2017
Applicants:

Imec Vzw, Leuven, BE;

Universiteit Gent, Ghent, BE;

Inventor:
Assignees:

IMEC VZW, Leuven, BE;

Universiteit Gent, Ghent, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); B29D 11/00 (2006.01); H05K 3/00 (2006.01); B29K 701/12 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0281 (2013.01); B29D 11/00038 (2013.01); B29D 11/00807 (2013.01); H05K 3/0014 (2013.01); H05K 3/0026 (2013.01); B29K 2701/12 (2013.01); H05K 2201/2009 (2013.01);
Abstract

In a first aspect, the present disclosure relates to a method for designing a pattern of a stress relief layer for a flat device to be transformed into a shape-retaining non-flat device by deformation of the flat device. The flat device (and thus also the non-flat device) may comprise at least two components and at least one electrical interconnection between two components. In a second aspect, the present disclosure is related to a method of manufacturing a shape-retaining non-flat device by deformation of a flat device, wherein the flat device is attached to a patterned stress relief layer designed in accordance with the first aspect of the present disclosure. In preferred embodiments, the stress relief layer is a thermoplastic layer or a layer comprising a thermoplastic material and deformation of the flat device comprises deformation by a thermoforming process, after attachment of the flat device to the stress relief layer.


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Vasquez Quintero, Andres. (2022). Method for forming non-flat devices (U.S. Patent No. 11357102). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11357102

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