The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2022

Filed:

Sep. 11, 2018
Applicant:

Knowles Cazenovia, Inc., Cazenovia, NY (US);

Inventor:

David Bates, Fayetteville, NY (US);

Assignee:

KNOWLES CAZENOVIA, INC., Cazenovia, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 5/16 (2006.01); H01P 1/20 (2006.01); H01P 11/00 (2006.01); H01P 3/08 (2006.01); H01L 25/065 (2006.01); H01L 23/538 (2006.01); H05K 3/46 (2006.01); H01L 23/66 (2006.01); H01L 23/552 (2006.01); H05K 1/14 (2006.01); H01L 25/10 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/22 (2006.01); H05K 3/32 (2006.01); H05K 3/36 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01P 5/16 (2013.01); H01L 23/5387 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 25/0655 (2013.01); H01L 25/105 (2013.01); H01P 1/20 (2013.01); H01P 3/081 (2013.01); H01P 11/003 (2013.01); H05K 1/028 (2013.01); H05K 1/0243 (2013.01); H05K 1/115 (2013.01); H05K 1/144 (2013.01); H05K 1/147 (2013.01); H05K 3/0011 (2013.01); H05K 3/22 (2013.01); H05K 3/32 (2013.01); H05K 3/361 (2013.01); H05K 3/4691 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6683 (2013.01); H01L 2224/16227 (2013.01); H01L 2225/107 (2013.01); H01L 2225/1047 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/351 (2013.01); H05K 1/0216 (2013.01); H05K 1/189 (2013.01); H05K 3/363 (2013.01); H05K 2201/041 (2013.01); H05K 2201/042 (2013.01); H05K 2201/058 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10053 (2013.01);
Abstract

A microwave or radio frequency (RF) device includes stacked printed circuit boards (PCBs) mounted on a flexible PCB having at least one ground plane and a signal terminal. Each of the stacked PCBs includes through-holes the sidewalls of which are coated with a conductive material. Microwave components are mounted on the flexible PCB within the through-holes, such that signal terminals of the components bond to signal terminals of respective through-holes. A conductive cover is mounted on the PCBs such that the cover is in electrical contact with the ground plane of the flexible PCB through the conductive material, forming shielding cavities around the components. The flexible PCB is folded such that the cover of one PCB faces the cover of the second PCB. The flexible PCB includes striplines or microstrips that carry RF or microwave signals to the signal terminals.


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