The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2022

Filed:

Aug. 23, 2018
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Yuichi Nagahisa, Tokyo, JP;

Shiro Hino, Tokyo, JP;

Hideyuki Hatta, Tokyo, JP;

Koji Sadamatsu, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/16 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H02M 1/08 (2006.01); H02M 7/5387 (2007.01);
U.S. Cl.
CPC ...
H01L 29/7806 (2013.01); H01L 29/1608 (2013.01); H01L 29/41741 (2013.01); H01L 29/66712 (2013.01); H02M 1/08 (2013.01); H02M 7/53871 (2013.01);
Abstract

In SiC-MOSFETs including Schottky diodes, passage of a bipolar current to a well region in a terminal region cannot be sufficiently reduced, which may reduce the reliability of elements. A SiC-MOSFET including Schottky diodes includes a gate electrode formed, through a second insulating film thicker than a gate insulating film in an active region, on a separation region between a first well region in the active region that is the closest to the terminal region and a second well region in the terminal region, wherein the second well region has a non-ohmic connection to a source electrode. Thus, a decrease in the reliability of elements is prevented.


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