The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2022

Filed:

Jan. 21, 2021
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Hiroyuki Tomomatsu, Dallas, TX (US);

Sameer Pendharkar, Allen, TX (US);

Hiroshi Yamasaki, Aizuwakamatsu, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 29/40 (2006.01); H01L 29/778 (2006.01); H01L 29/423 (2006.01); H01L 23/482 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 29/404 (2013.01); H01L 23/4824 (2013.01); H01L 29/4238 (2013.01); H01L 29/7786 (2013.01); H01L 29/2003 (2013.01);
Abstract

A transistor device includes a field plate that extends from a source runner layer and/or a source contact layer. The field plate can be coplanar with and/or below a gate runner layer. The gate runner layer is routed away from a region directly above the gate metal layer by a gate bridge, such that the field plate can extend directly above the gate metal layer without being interfered by the gate runner layer. Coplanar with the source runner layer or the source contact layer, the field plate is positioned close to the channel region, which helps reduce its parasitic capacitance. By vertically overlapping the metal gate layer and the field plate, the disclosed HEMT device may achieve significant size efficiency without additional routings.


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