The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2022
Filed:
Nov. 15, 2018
Applicant:
Hkc Corporation Limited, Guangdong, CN;
Inventor:
Jianfeng Shan, Guangdong, CN;
Assignee:
HKC Corporation Limited, Guangdong, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/04 (2006.01); H01L 27/12 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 27/124 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/08 (2013.01); H01L 24/32 (2013.01); H01L 25/18 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/06165 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/32227 (2013.01);
Abstract
An array substrate () comprises a display region () and a bonding region (). The bonding region () is disposed around the display region (). The bonding region () of the array substrate () is provided with at least one pad (). The at least one pad () comprises a plurality of first gold fingers () spaced apart and arranged in parallel. Intervals between adjacent first golden fingers () in the same pad () are not entirely the same.