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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11355444 B1

PDFFull Text
Date of Patent:
Jun. 07, 2022

Filed:

Jan. 20, 2017

Semiconductor device, electronic module, electronic apparatus each having stacked embedded active components in multilayer wiring board and method for producing the semiconductor device having the same

Applicant:

Sony Corporation, Tokyo, JP;

Inventor:

Hirohisa Yasukawa, Kanagawa, JP;

Assignee:

SONY CORPORATION, Tokyo, JP;

Attorney:

Sheridan Ross P.C.

Primary Examiner:

Michael Jung

Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/538 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 25/0657 (2013.01); H01L 2225/06548 (2013.01);
Abstract

To provide a semiconductor device further reduced in size. A semiconductor device including: a multilayer wiring board one surface of which is provided with an external connection terminal; and a plurality of active components that are provided to be stacked inside the multilayer wiring board and are connected to the external connection terminal via a connection via. The plurality of active components include a first active component provided on another surface side that is opposite to the one surface, and a second active component that is provided closer to the one surface than the first active component is and has a smaller planar area than the first active component.

Find Patent Forward Citations

Yasukawa, Hirohisa. (2022). Semiconductor device, electronic module, electronic apparatus each having stacked embedded active components in multilayer wiring board and method for producing the semiconductor device having the same (U.S. Patent No. 11355444). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11355444

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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