The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2022
Filed:
Jan. 28, 2020
Infineon Technologies Ag, Neubiberg, DE;
Paul Armand Asentista Calo, Melaka, MY;
Tek Keong Gan, Melaka, MY;
Ser Yee Keh, Johor, MY;
Tien Heng Lem, Melaka, MY;
Fong Lim, Melaka, MY;
Michael Stadler, Munich, DE;
Mei Qi Tay, Melaka, MY;
Infineon Technologies AG, Neubiberg, DE;
Abstract
An electrical interconnect structure includes a bond pad having a substantially planar bonding surface, and a solder enhancing structure that is disposed on the bonding surface and includes a plurality of raised spokes that are each elevated from the bonding surface. Each of the raised spokes has a lower wettability relative to a liquefied solder material than the bonding surface. Each of the raised spokes extend radially outward from a center of the solder enhancing structure.