The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2022
Filed:
May. 27, 2020
Fuji Electric Co., Ltd., Kanagawa, JP;
Toru Yamada, Matsumoto, JP;
FUJI ELECTRIC CO., LTD., Kanagawa, JP;
Abstract
Provided is a cooling apparatus for a semiconductor module including a semiconductor chip, the apparatus including a ceiling plate having a bottom surface; and a case portion having two sets of opposing edges in an overhead view, and including a flow portion arranged on the plate's bottom surface side and allowing coolant to flow therethrough, an outer edge portion surrounding the flow portion, and a side wall provided on the outer edge portion's inner side, the side wall including a first constricted portion changing the flow portion's width in a first direction parallel to one of the edge sets, along a second direction orthogonal to the first direction, a fastening portion for fastening the plate and the case portion to an external apparatus provided where the plate and the outer edge portion are overlapped and arranged, and the fastening portion arranged opposite the first constricted portion in the first direction.