The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2022
Filed:
Sep. 30, 2019
Applicant:
Enjet Co. Ltd., Suwon-si, KR;
Inventors:
Assignee:
ENJET CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/563 (2013.01); H01L 21/67126 (2013.01); H01L 21/68764 (2013.01); H01L 21/565 (2013.01); H01L 21/6715 (2013.01); H01L 21/67103 (2013.01); H01L 21/67121 (2013.01); H01L 21/67259 (2013.01); H01L 21/683 (2013.01); H01L 2924/15151 (2013.01);
Abstract
Disclosed are an underfill method and apparatus for a semiconductor package, the underfill method includes loading a substrate; charging a filler to be filled in between the substrate and a device; applying the filler to the substrate; and subjecting the applied filler to an electric field.