The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2022

Filed:

Jan. 20, 2020
Applicant:

Denso Corporation, Kariya, JP;

Inventor:

Kazuaki Mawatari, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/12 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/433 (2006.01); H01L 25/04 (2014.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 21/56 (2013.01); H01L 23/12 (2013.01); H01L 23/29 (2013.01); H01L 23/31 (2013.01); H01L 23/4334 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/043 (2013.01); H01L 25/18 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01);
Abstract

A semiconductor device includes a semiconductor element, an electronic component electrically connected to the semiconductor element, a connection member electrically connecting the electronic component to the semiconductor element, and a sealing resin portion having a first surface and a second surface opposite to the first surface and integrally holding the semiconductor element, the electronic component, and the connection member in a state where a semiconductor top surface as a surface of the semiconductor element and a component surface as a surface of the electronic component are exposed from the sealing resin portion on a side adjacent to the first surface.


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