The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2022
Filed:
Aug. 19, 2019
Applicant:
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Inventors:
Takaharu Nagai, Tokyo, JP;
Yuichi Inazuki, Tokyo, JP;
Katsutoshi Suzuki, Tokyo, JP;
Ryugo Hikichi, Tokyo, JP;
Koji Ichimura, Tokyo, JP;
Saburou Harada, Tokyo, JP;
Assignee:
DAI NIPPON PRINTING CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); H01L 21/027 (2006.01); B29C 59/02 (2006.01); B29C 35/08 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); B29C 59/022 (2013.01); B29C 59/026 (2013.01); H01L 21/027 (2013.01); B29C 35/0805 (2013.01); B29C 2035/0827 (2013.01);
Abstract
An imprint method using a mold and/or a transfer substrate having a mesa structure includes a resin supply step, a contact step, a curing step, and a mold release step. In the resin supply step, a balance layer is formed by supplying a molded resin also to an area outside of a pattern formation area of the transfer substrate in which a pattern structure is to be formed.