The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2022

Filed:

Dec. 26, 2018
Applicant:

Wuhan China Star Optoelectronics Technology Co. Ltd., Hubei, CN;

Inventors:

Guowei Zha, Hubei, CN;

Changwen Ma, Hubei, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02F 1/1335 (2006.01); G02F 1/13357 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
G02F 1/133612 (2021.01); G02F 1/133603 (2013.01); G02F 1/133605 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01);
Abstract

A backlight module and a liquid crystal display are provided. The backlight module has a substrate, a plurality of soldering pads, and a reflective pattern layer. The soldering pads are distributed on the substrate and each of the soldering pads has a soldering pad size. The reflective pattern layer covers the soldering pads and the substrate. The reflective pattern layer has openings, positions of the openings correspond to positions of the soldering pads, each of the openings has an opening size, and the opening size is smaller than the corresponding soldering pad size. The backlight module is provided with the openings in the reflective pattern corresponding to the positions of the soldering pads, and the opening size of the openings is smaller than the soldering pad size of the soldering pads, thereby increasing a ratio of the reflective pattern layer to the substrate. Therefore, brightness is improved.


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