The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2022

Filed:

Oct. 14, 2020
Applicant:

Cisco Technology, Inc., San Jose, CA (US);

Inventors:

Ashley J. M. Erickson, Danville, CA (US);

Vipulkumar K. Patel, Breinigsville, PA (US);

Aparna R. Prasad, San Jose, CA (US);

Assignee:

Cisco Technology, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); G02B 6/13 (2006.01); G02B 6/12 (2006.01);
U.S. Cl.
CPC ...
G02B 6/428 (2013.01); G02B 6/12004 (2013.01); G02B 6/13 (2013.01); G02B 6/4269 (2013.01); G02B 2006/12085 (2013.01);
Abstract

An integrated circuit (IC) package having multiple ICs is provided. The IC package includes a printed circuit board (PCB) having a cutout region and a substrate disposed above the PCB. The substrate includes a first cavity on a first surface of the substrate. The IC package also includes a first IC disposed on a second surface of the substrate and in the cutout region of the PCB, The IC package further includes a second IC disposed above the substrate, and a first device disposed on the second IC and in the first cavity on the first surface of the substrate.


Find Patent Forward Citations

Loading…