The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2022

Filed:

Jun. 01, 2020
Applicant:

GE Precision Healthcare Llc, Milwaukee, WI (US);

Inventors:

Sathish Ramani, Niskayuna, NY (US);

Mingye Wu, Clifton Park, NY (US);

Bruno De Man, Clifton Park, NY (US);

Peter Edic, Albany, NY (US);

Assignee:

GE Precision Healthcare LLC, Milwaukee, WI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 11/00 (2006.01); G01N 23/046 (2018.01); A61B 6/03 (2006.01); G06T 7/00 (2017.01);
U.S. Cl.
CPC ...
G01N 23/046 (2013.01); G06T 11/005 (2013.01); G06T 11/008 (2013.01); A61B 6/032 (2013.01); G06T 7/0012 (2013.01); G06T 2207/30004 (2013.01); G06T 2211/408 (2013.01);
Abstract

Various methods and systems are provided for multi-material decomposition for computed tomography. In one embodiment, a method comprises acquiring, via an imaging system, projection data for a plurality of x-ray spectra, estimating path lengths for a plurality of materials based on the projection data and calibration data for the imaging system, iteratively refining the estimated path lengths based on a linearized model derived from the calibration data, and reconstructing material-density images for each material of the plurality of materials from the iteratively-refined estimated path lengths. By determining path-length estimates in this way without modeling the physics of the imaging system, accurate material decomposition may be performed more quickly and with less sensitivity to changes in physics of the system, and furthermore may be extended to more than two materials.


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