The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2022

Filed:

Jun. 20, 2019
Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka, JP;

Inventors:

Hiroki Nakatsuchi, Tokyo, JP;

Yasuo Onose, Hitachinaka, JP;

Takayuki Yogo, Hitachinaka, JP;

Ryotaro Shimada, Tokyo, JP;

Assignee:

Hitachi Astemo, Ltd., Hitachinaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01F 1/692 (2006.01); G01F 1/38 (2006.01); G01F 1/684 (2006.01);
U.S. Cl.
CPC ...
G01F 1/692 (2013.01); G01F 1/38 (2013.01); G01F 1/684 (2013.01);
Abstract

A flow-rate sensor is provided with a lead frame, a semiconductor chip that is disposed on one surface of the lead frame, and in which a diaphragm including a void portion on the lead frame side is formed, a flow rate detecting unit that is formed on the one surface including the diaphragm of the semiconductor chip, and resin that includes a flow passage opening portion exposing at least a portion of the flow rate detecting unit formed on the diaphragm, and covers the lead frame and the semiconductor chip. A lower side resin portion of the resin covering another surface side of the lead frame, on an opposite side to the one surface side thereof, has a thinned portion that is thinner than a periphery thereof in a region facing a peripheral edge portion of the diaphragm.


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