The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2022

Filed:

May. 24, 2021
Applicant:

Google Llc, Mountain View, CA (US);

Inventors:

Arun Raghupathy, Pleasanton, CA (US);

Benjamin Niewood, San Francisco, CA (US);

Cheng-Jung Lee, San Jose, CA (US);

Adam Scott Kilgore, San Rafael, CA (US);

Assignee:

Google LLC, Mountain View, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); F16M 11/20 (2006.01); F16M 13/00 (2006.01); F16M 11/10 (2006.01); F16M 13/02 (2006.01); F16M 11/14 (2006.01); G03B 17/08 (2021.01); G03B 17/55 (2021.01); H04N 7/18 (2006.01); H05K 7/20 (2006.01); F16M 11/04 (2006.01); F16M 11/06 (2006.01); A47B 97/00 (2006.01); G03B 17/56 (2021.01); F21V 21/30 (2006.01); F21V 21/088 (2006.01); F16M 11/38 (2006.01);
U.S. Cl.
CPC ...
F16M 11/2035 (2013.01); F16M 11/105 (2013.01); F16M 11/14 (2013.01); F16M 13/00 (2013.01); F16M 13/005 (2013.01); F16M 13/02 (2013.01); F16M 13/022 (2013.01); G03B 17/08 (2013.01); G03B 17/55 (2013.01); H04N 5/2252 (2013.01); H04N 7/181 (2013.01); H05K 7/20445 (2013.01); A47B 2097/003 (2013.01); F16M 11/041 (2013.01); F16M 11/06 (2013.01); F16M 11/2007 (2013.01); F16M 11/2064 (2013.01); F16M 11/38 (2013.01); F21V 21/088 (2013.01); F21V 21/30 (2013.01); G03B 17/561 (2013.01); H04N 5/2254 (2013.01);
Abstract

This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing, and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.


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