The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2022
Filed:
Aug. 17, 2018
Applicant:
Kcf Technologies Co., Ltd., Anyang-si, KR;
Inventors:
Seung Min Kim, Anyang-si, KR;
An Na Lee, Anyang-si, KR;
Ho Gun Kim, Anyang-si, KR;
Shan Hua Jin, Anyang-si, KR;
Assignee:
SK NEXILIS CO., LTD., Jeongeup-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 1/04 (2006.01); C25D 3/38 (2006.01); H05K 1/09 (2006.01); H01M 4/66 (2006.01); C25D 7/06 (2006.01); C25D 3/58 (2006.01); C25D 5/00 (2006.01); H05K 1/03 (2006.01); H05K 3/02 (2006.01); H01M 10/0525 (2010.01);
U.S. Cl.
CPC ...
C25D 1/04 (2013.01); C25D 3/38 (2013.01); C25D 3/58 (2013.01); C25D 5/605 (2020.08); C25D 5/617 (2020.08); C25D 7/0614 (2013.01); H01M 4/661 (2013.01); H01M 4/667 (2013.01); H05K 1/09 (2013.01); C23C 2222/20 (2013.01); H01M 10/0525 (2013.01); H05K 1/0393 (2013.01); H05K 3/022 (2013.01); H05K 2201/0355 (2013.01); H05K 2203/0726 (2013.01);
Abstract
Disclosed is a copper foil including a copper layer and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a peak to arithmetic mean roughness (PAR) of 0.8 to 12.5, a tensile strength of 29 to 58 kgf/mm, and a weight deviation of 3% or less, wherein the PAR is calculated in accordance with the following Equation 1:  [Equation 1]