The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2022
Filed:
Aug. 31, 2018
Nitto Denko Corporation, Ibaraki, JP;
Tomoaki Ichikawa, Ibaraki, JP;
Yuki Sugo, Ibaraki, JP;
Mayu Shimoda, Ibaraki, JP;
Ryota Mita, Ibaraki, JP;
NITTO DENKO CORPORATION, Ibaraki, JP;
Abstract
The sinter-bonding composition contains sinterable particles containing an electroconductive metal. The average particle diameter of the sinterable particles is 2 μm or less and the proportion of the particles having a particle diameter of 100 nm or less in the sinterable particles is not less than 80% by mass. The sinter-bonding sheet () has an adhesive layer made from such a sinter-bonding composition. The dicing tape with a sinter-bonding sheet (X) has such a sinter-bonding sheet () and a dicing tape (). The dicing tape () has a lamination structure containing a base material () and an adhesive layer (), and the sinter-bonding sheet () is positioned on the adhesive layer () of the dicing tape ().