The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2022

Filed:

Jan. 21, 2021
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Cyrus A. Anderson, Bellingham, WA (US);

Thomas Q. Chastek, St. Paul, MN (US);

Xiao Gao, Woodbury, MN (US);

Kathleen S. Shafer, Woodbury, MN (US);

Sheng Ye, Woodbury, MN (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); C09J 5/00 (2006.01); C09J 163/00 (2006.01); B32B 17/10 (2006.01); C08L 71/00 (2006.01); B32B 37/12 (2006.01); C09J 131/04 (2006.01); C09J 167/00 (2006.01);
U.S. Cl.
CPC ...
C09J 5/00 (2013.01); B32B 7/12 (2013.01); B32B 17/10 (2013.01); B32B 17/10005 (2021.01); B32B 17/10293 (2013.01); B32B 37/12 (2013.01); C08L 71/00 (2013.01); C09J 131/04 (2013.01); C09J 163/00 (2013.01); C09J 167/00 (2013.01); B32B 2037/1253 (2013.01); B32B 2605/006 (2013.01); C09J 2301/416 (2020.08); C09J 2400/143 (2013.01); C09J 2431/00 (2013.01); C09J 2463/00 (2013.01); C09J 2467/00 (2013.01);
Abstract

Methods of bonding together substrates that do not require use of primers, mixing, fixturing, or autoclaving. These methods can include the steps of disposing an adhesive layer on a bonding surface of either substrate, the adhesive layer comprising a curable composition that is dimensionally stable at ambient conditions; either before or after disposing the adhesive layer on the bonding surface, irradiating the adhesive layer with ultraviolet radiation to initiate curing of the curable composition; placing one substrate so as to be bonded to the other substrate by the adhesive layer; and allowing the adhesive layer to cure.


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