The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2022

Filed:

Dec. 28, 2017
Applicant:

Kuraray Co., Ltd., Kurashiki, JP;

Inventors:

Makoto Okamoto, Kurashiki, JP;

Hirotaka Shiota, Okayama, JP;

Makoto Suzuki, Kurashiki, JP;

Assignee:

KURARAY CO., LTD., Kurashiki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/22 (2006.01); C08L 29/04 (2006.01); B32B 1/02 (2006.01); B65D 1/02 (2006.01); B29C 48/00 (2019.01); B29C 48/21 (2019.01); B29C 49/00 (2006.01); B29C 49/06 (2006.01); B29C 49/08 (2006.01); B29C 49/22 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01); C08J 5/18 (2006.01); C08K 3/36 (2006.01); C08K 3/10 (2018.01); B29K 23/00 (2006.01); B29K 509/02 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
C08K 3/22 (2013.01); B29C 48/0018 (2019.02); B29C 48/022 (2019.02); B29C 48/21 (2019.02); B29C 49/0005 (2013.01); B29C 49/06 (2013.01); B29C 49/08 (2013.01); B29C 49/221 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/306 (2013.01); B65D 1/0215 (2013.01); C08J 5/18 (2013.01); C08K 3/10 (2013.01); C08K 3/36 (2013.01); B29K 2023/086 (2013.01); B29K 2509/02 (2013.01); B29L 2031/7158 (2013.01); B32B 2307/518 (2013.01); B32B 2439/60 (2013.01); C08J 2323/08 (2013.01); C08K 2003/222 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2244 (2013.01);
Abstract

A resin composition comprises: a modified EVOH (A) that is represented by a following formula (I), has contents (mol %) of a, b, and c based on the total monomer units satisfying following formulae (1) through (3), and has a degree of saponification (DS) defined by a following formula (4) of 90 mol % or more; and inorganic oxide particles (B), wherein a content of the inorganic oxide particles (B) is from 5 to 5000 ppm. Such a resin composition is improved in adhesion to a resin other than EVOH, secondary processability, and flexibility without decreasing the performances originally possessed by EVOH, such as gas barrier properties, transparency, flavor retention, solvent resistance, and oil resistance. Accordingly, the resin is preferably used as a molded article, a film, a sheet, a heat shrinkable film, a thermoformed article, a multilayer structure, a coinjection stretch blow molded container, a fuel container, and the like. 18≤≤55  (1)0.01≤≤20  (2)[100−()]×0.9≤≤[100−()]  (3)DS=[(Total Number of Moles of Hydrogen Atoms in, and)/(Total Number of Moles of, and)]×100  (4).


Find Patent Forward Citations

Loading…