The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2022
Filed:
Apr. 13, 2017
Applicant:
Teijin Limited, Osaka, JP;
Inventors:
Kazuma Kurokawa, Chiyoda-ku, JP;
Tetsuya Akamatsu, Chiyoda-ku, JP;
Hiroaki Kuwahara, Chiyoda-ku, JP;
Assignee:
TEIJIN LIMITED, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/24 (2006.01); B32B 27/12 (2006.01); C08J 5/06 (2006.01);
U.S. Cl.
CPC ...
C08J 5/24 (2013.01); B32B 27/12 (2013.01); C08J 5/06 (2013.01); B32B 2262/106 (2013.01); B32B 2305/076 (2013.01); B32B 2305/34 (2013.01); B32B 2307/202 (2013.01); C08J 2300/12 (2013.01); C08J 2300/22 (2013.01);
Abstract
The present invention provides a prepreg which is composed of at least a matrix resin and reinforcing fibers, and which is characterized in that: conductive parts are formed on one surface or both surfaces of a fiber layer that is formed of the reinforcing fibers; and the volume resistivity ρ (Ωcm) of the fiber layer in the thickness direction, the thickness t (cm) of the fiber layer and the average interval L (cm) between the conductive parts arranged on the prepreg surface satisfy formula (1)./ρ×1/×100≥0.5  Formula (1):