The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2022

Filed:

Feb. 10, 2020
Applicant:

Pink Gmbh Thermosysteme, Wertheim, DE;

Inventors:

Christoph Oetzel, Freudenberg-Boxtal, DE;

Sebastian Clärding, Würzburg, DE;

Assignee:

PINK GMBH THERMOSYSTEME, Wertheim, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/04 (2006.01); H01L 23/34 (2006.01); B23K 1/00 (2006.01); B23K 3/08 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 3/04 (2013.01); B23K 1/0016 (2013.01); B23K 3/085 (2013.01); B23K 2101/40 (2018.08);
Abstract

A heat transfer device for thermal coupling of a component to be soldered with a heat source or a heat sink in a soldering machine includes a heat source or a heat sink, and at least one base plate, said base plate being in thermally conductive contact at least with the heat source or the heat sink, said base plate comprising at least two contact units having respective contact surfaces, said contact surfaces being thermally contactable to the component, said contact units being designed in such a way that relative distances between the contact surfaces and the surface of the base plate facing the component are changeable.


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