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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11350523 B1

PDFFull Text
Date of Patent:
May. 31, 2022

Filed:

Jan. 19, 2017

Ceramic wiring board and method for producing the same

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Takahiro Sumi, Nagaokakyo, JP;

Takahiro Oka, Nagaokakyo, JP;

Yoshitake Yamagami, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo, JP;

Attorney:

ArentFox Schiff LLP

Primary Examiner:

Timothy J Thompson

Assistant Examiner:

Rhadames Alonzo Miller

Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 3/12 (2006.01); H05K 3/40 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/22 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0306 (2013.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01); H05K 3/0044 (2013.01); H05K 3/1291 (2013.01); H05K 3/22 (2013.01); H05K 3/4038 (2013.01); H05K 3/4061 (2013.01); H05K 3/4647 (2013.01); H05K 3/4629 (2013.01); H05K 2201/0175 (2013.01); H05K 2201/098 (2013.01); H05K 2201/09563 (2013.01); H05K 2201/09809 (2013.01); H05K 2203/1126 (2013.01);
Abstract

A ceramic wiring board that includes a ceramic insulator and a via-conductor. The ceramic insulator includes a crystalline constituent and an amorphous constituent. The via-conductor includes a metal and an oxide. The crystalline constituent and the oxide include at least one metal element in common. A tubular region having a thickness of 5 μm adjoins and surrounds the via-conductor and has a higher concentration of the metal element than the ceramic insulator.

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Sumi, Takahiro. (2022). Ceramic wiring board and method for producing the same (U.S. Patent No. 11350523). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11350523

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