The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2022
Filed:
Mar. 25, 2020
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Wasif Tanveer Khan, Lahore, PK;
Ahmad Waleed, Lahore, PK;
Arndt Thomas Ott, Stuttgart, DE;
Ramona Hotopan, Stuttgart, DE;
Assignee:
SONY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01Q 15/00 (2006.01); H01Q 23/00 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); G01S 7/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0236 (2013.01); H01L 23/66 (2013.01); H01L 24/13 (2013.01); H01Q 15/008 (2013.01); H01Q 23/00 (2013.01); G01S 7/032 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/1623 (2013.01); H01L 2224/16227 (2013.01);
Abstract
A microwave antenna apparatus comprises a package module comprising a semiconductor unit, an antenna unit arranged on a first side of the package module and a redistribution layer group arranged on a second side of the package module opposite the first side, and an electromagnetic band gap structure, EBG, module coupled to the redistribution layer group of the package module.