The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2022
Filed:
Jan. 17, 2020
Sae Magnetics (H.k.) Ltd., Hong Kong, HK;
Masashi Shiraishi, Hong Kong, HK;
Hironobu Hayashi, Hong Kong, HK;
Toyotaka Kobayashi, Hong Kong, HK;
SAE Magnetics (H.K.) Ltd., Hong Kong, HK;
Abstract
A MEMS package has a MEMS chip, a package substrate which the MEMS chip is adhered, a chip cover which wraps the MEMS chip, and a pressure regulation film which is adhered to the front surface of the chip cover. The chip cover has a vent which is formed in a chip outside area, arranged outside than the MEMS chip, the pressure regulation film has a slit. The slit is arranged in the neighborhood of the vent and the vent is covered with the pressure regulation film.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile