The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2022

Filed:

Nov. 22, 2019
Applicant:

Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v., Munich, DE;

Inventors:

Fabian Stoppel, Itzehoe, DE;

Bernhard Wagner, Looft, DE;

Shanshan Gu-Stoppel, Itzehoe, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H04R 25/00 (2006.01); H04R 17/00 (2006.01); H04R 7/06 (2006.01); H04R 7/26 (2006.01);
U.S. Cl.
CPC ...
H04R 17/00 (2013.01); H04R 7/06 (2013.01); H04R 7/26 (2013.01);
Abstract

A micromechanical sound transducer according to a first aspect includes a first bending transducer with a free end and a second bending transducer with a free end, the two bending transducers being arranged in a mutual plane, wherein the free end of the first bending transducer is separated from the free end of the second bending transducer via a slit. The second bending transducer is excited in-phase with the vertical vibration of the first bending transducer. A micromechanical sound transducer according to a second aspect includes a first bending transducer that is excited to vibrate vertically and a diaphragm element extending vertically to the first bending transducer, the diaphragm element being separated from a free end of the first bending transducer via a slit.


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