The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2022

Filed:

Jan. 08, 2021
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Issei Yamamoto, Kyoto, JP;

Atsunobu Okazaki, Kyoto, JP;

Yuki Asano, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 7/01 (2006.01); H03H 1/00 (2006.01); H03H 3/00 (2006.01);
U.S. Cl.
CPC ...
H03H 7/0115 (2013.01); H03H 1/00 (2013.01); H03H 3/00 (2013.01); H03H 2001/0085 (2013.01);
Abstract

Provided is a laminated electronic component in which defective formation is unlikely to cause in a shield conductor layer on a side surface of a laminate. The laminated electronic component includes a laminatein which substrate layerstoare laminated, having an outer surface including a first main surfaceB, a second main surfaceT, and a side surfaceS, internal electrodes (a ground electrodecoil electrodescapacitor electrodesand wiring electrodes), an external electrodeand a first plating layerformed on a surface of the external electrode


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