The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2022

Filed:

Nov. 13, 2020
Applicant:

Yazaki Corporation, Tokyo, JP;

Inventors:

Yoshiaki Ichikawa, Makinohara, JP;

Tatsuya Oga, Makinohara, JP;

Mariko Nakagawa, Makinohara, JP;

Tomoji Yasuda, Makinohara, JP;

Assignee:

Yazaki Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H01R 12/65 (2011.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01R 12/65 (2013.01); H05K 1/189 (2013.01); H05K 1/181 (2013.01); H05K 2201/10272 (2013.01); H05K 2201/2009 (2013.01);
Abstract

A connection structure includes: a circuit body including a flexible printed circuit having a wiring pattern; and a conductive body connected to a mounting surface of the circuit body using a solder. The conductive body has a pair of connection portions opposed to each other and extending along the mounting surface. The solder forms solder fillets located around the pair of connection portions and extending along the mounting surface. A first fillet width of one solder fillet among the solder fillets located in an inside region between the pair of connection portions is larger than a second fillet width of another solder among the solder fillets located in an outside region of one of the pair of connection portions, which is on a side opposite to the inside region across the one of the pair of connection portions.


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