logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11349053 B1

PDFFull Text
Date of Patent:
May. 31, 2022

Filed:

Jan. 14, 2020

Flexible interconnect using conductive adhesive

Applicant:

Facebook Technologies, Llc, Menlo Park, CA (US);

Inventors:

Zheng Sung Chio, Cork, IE;

Daniel Brodoceanu, Cork, IE;

Ali Sengül, Zurich, CH;

Oscar Torrents Abad, Cork, IE;

Jeb Wu, Redmond, WA (US);

Pooya Saketi, Cork, IE;

Chao Kai Tung, Cork, IE;

Tennyson Nguty, Cork, IE;

Allan Pourchet, Cork, IE;

Assignee:

Facebook Technologies, LLC, Menlo Park, CA (US);

Attorney:

Fenwick & West LLP

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 23/48 (2006.01); H01L 31/0203 (2014.01); H01L 21/00 (2006.01); H01L 21/46 (2006.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01); C09J 9/02 (2006.01); C09J 5/00 (2006.01); H01L 33/52 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); C09J 5/00 (2013.01); C09J 9/02 (2013.01); H01L 25/0756 (2013.01); H01L 33/52 (2013.01); H01L 2933/0066 (2013.01);
Abstract

Embodiments relate to the design of an electronic device capable having flexible interconnects that connect together a first body and a second body of the electronic device. The flexible interconnects allow the electrical device to better withstand thermal-mechanical stress during fabrication of the electronic device and user usage of the electronic device.

Find Patent Forward Citations

Quick Actions:

Chio, Zheng. (2022). Flexible interconnect using conductive adhesive (U.S. Patent No. 11349053). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11349053

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…