The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2022

Filed:

Nov. 04, 2019
Applicant:

Harvatek Corporation, Hsinchu, TW;

Inventors:

Zhi Ting Ye, Hsinchu, TW;

Shyi Ming Pan, Hsinchu, TW;

Feng Hui Chuang, Hsinchu, TW;

Assignee:

Harvatek Corporation, Hsin Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/44 (2010.01); H01L 33/58 (2010.01); H01L 33/56 (2010.01); H01L 33/32 (2010.01); H01L 33/34 (2010.01);
U.S. Cl.
CPC ...
H01L 33/44 (2013.01); H01L 33/32 (2013.01); H01L 33/346 (2013.01); H01L 33/56 (2013.01); H01L 33/58 (2013.01);
Abstract

The application is related to a UV LED package structure for improving light extraction efficiency. An UV LED chip is set on a substrate with an anti-flare film for increasing upward light extraction to concentrate the emitted light by an optical element. Because no glue is filled between the UV LED chip and the optical element, it will be prevented the glue from spoiling and deteriorating by the UV light from the UV LED chip. Thereby, the UV LED package structure can prevent from the light performance reducing.


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