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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11348952 B1

PDFFull Text
Date of Patent:
May. 31, 2022

Filed:

May. 29, 2019

Connection structure and fabrication method thereof, array substrate and fabrication method thereof

Applicants:

Chengdu Boe Optoelectronics Technology Co., Ltd., Chengdu, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Zhen Zhang, Beijing, CN;

Pengyu Liao, Beijing, CN;

Assignees:

CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., Sichuan, CN;

BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;

Attorneys:

Dilworth & Barrese, LLP.

Michael J. Musella, Esq.

Primary Examiner:

Fazli Erdem

Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 21/31 (2006.01); G06F 1/16 (2006.01); H01L 27/32 (2006.01); H01L 21/311 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1288 (2013.01); H01L 27/1244 (2013.01); H01L 27/1248 (2013.01); H01L 27/3258 (2013.01); H01L 27/3276 (2013.01); H01L 21/31144 (2013.01); H01L 51/0097 (2013.01);
Abstract

Embodiments of the present provide a connection structure and a manufacturing thereof, an array substrate and a manufacturing method thereof, the manufacturing method of the connection structure includes: forming a first insulating layer on a base substrate forming a mask layer having a first opening on a side of the first insulating layer away from the base substrate; forming a second insulating layer op a side of the mask layer away-from the first insulating layer; forming a second opening exposing the first opening in the second insulating layer by one patterning process, and forming a third opening in the first insulating layer.

Find Patent Forward Citations

Zhang, Zhen. (2022). Connection structure and fabrication method thereof, array substrate and fabrication method thereof (U.S. Patent No. 11348952). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11348952

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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