The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2022

Filed:

Feb. 26, 2021
Applicant:

Seoul Semiconductor Co., Ltd., Gyeonggi-do, KR;

Inventors:

Jae Hyun Park, Gyeonggi-do, KR;

Seong Jin Lee, Gyeonggi-do, KR;

Jong Kook Lee, Gyeonggi-do, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); F21K 9/232 (2016.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 33/22 (2010.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); F21K 9/232 (2016.08); H01L 23/5387 (2013.01); H01L 23/562 (2013.01); H01L 33/22 (2013.01); H01L 33/50 (2013.01); H01L 33/62 (2013.01); H01L 2933/0091 (2013.01);
Abstract

A light emitting device filament includes a substrate, light emitting device chips, two electrode pads, and connection lines. The substrate includes a first surface and a second surface opposite to the first surface. The substrate extends in a first direction and has a width in a second direction. The light emitting device chips are disposed on the first surface of the substrate. The two electrode pads are disposed on the substrate. The connection lines electrically connect the light emitting device chips and the electrode pads. At least one of the connection lines includes a first portion extending in the first direction and a second portion extending in the second direction.


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