The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2022
Filed:
May. 30, 2018
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Shinya Yano, Tokyo, JP;
Assignee:
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/07 (2006.01); H01L 23/373 (2006.01); H01L 23/495 (2006.01); H01L 23/492 (2006.01); H01L 23/498 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 25/072 (2013.01); H01L 23/3735 (2013.01); H01L 23/492 (2013.01); H01L 23/49537 (2013.01); H01L 23/49541 (2013.01); H01L 23/49811 (2013.01); H01L 25/18 (2013.01); H01L 2224/40137 (2013.01);
Abstract
A semiconductor module includes: an upper arm module including a semiconductor chip; and a lower arm module including a semiconductor chip. The lower arm module is provided with: a facing section in which a lead frame and a lead frame each having a strip shape are disposed such that a main surface of the lead frame and a main surface of the lead frame face each other; and a non-facing section in which the lead frame and the lead frame are disposed such that the main surface of the lead frame and the main surface of the lead frame do not face each other.