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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11348902 B1

PDFFull Text
Date of Patent:
May. 31, 2022

Filed:

Nov. 21, 2017

Semiconductor module, power conversion device, and movable body

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventor:

Junya Sakai, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Antony M Paul

Int. Cl.
CPC ...
H01L 25/07 (2006.01); H01L 23/498 (2006.01); H01L 29/16 (2006.01); H01L 29/739 (2006.01); H02M 7/00 (2006.01); H02M 7/5387 (2007.01); H02P 27/08 (2006.01);
U.S. Cl.
CPC ...
H01L 25/072 (2013.01); H01L 23/49844 (2013.01); H01L 29/1608 (2013.01); H01L 29/7393 (2013.01); H02M 7/003 (2013.01); H02M 7/53871 (2013.01); H02P 27/08 (2013.01);
Abstract

A semiconductor module includes: a first terminal portion and a second terminal portion each connected to outside; and a first current path and a second current path to connect between the first terminal portion and the second terminal portion in parallel. The first current path includes: a first semiconductor device; a first wiring portion and a second wiring portion. The second current path includes: a second semiconductor device; a third wiring portion; and a fourth wiring portion. A power conducting capability of the first semiconductor device is lower than a power conducting capability of the second semiconductor device, and a total of an impedance of the first wiring portion and an impedance of the second wiring portion is lower than a total of an impedance of the third wiring portion and an impedance of the fourth wiring portion.

Find Patent Forward Citations

Sakai, Junya. (2022). Semiconductor module, power conversion device, and movable body (U.S. Patent No. 11348902). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11348902

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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