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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11348888 B1

PDFFull Text
Date of Patent:
May. 31, 2022

Filed:

Nov. 14, 2019

Electronic component and device

Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Hidemasa Oshige, Yokohama, JP;

Assignee:

Canon Kabushiki Kaisha, Tokyo, JP;

Attorney:

Canon U.S.A., Inc. I.P. Division

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H01L 21/02 (2006.01); H01L 23/13 (2006.01); H01L 23/34 (2006.01); H01L 23/36 (2006.01); H01L 27/32 (2006.01); H01L 27/148 (2006.01); H01L 51/00 (2006.01); H01L 51/52 (2006.01); H01L 23/00 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H05K 1/189 (2013.01); H01L 21/30604 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/83203 (2013.01); H01L 2924/10156 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10128 (2013.01);
Abstract

An electronic component includes an electronic device including a substrate, and a wiring board including a conductor unit electrically connected to the electronic device and an insulation unit configured to support the conductor unit. The substrate includes a front surface including a first region, a back surface including a second region, and an end surface connecting the front surface and the back surface. The substrate further includes a first portion located between the first region and the second region and a second portion having a thickness smaller than that of the first portion. The insulation unit of the wiring board is located between a virtual plane surface located between the first region and the second region and the second portion.

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