The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2022
Filed:
Aug. 20, 2020
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventors:
Yoshihiro Yoshida, Nagaokakyo, JP;
Koichi Yoshida, Nagaoka kyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); G01L 19/14 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/564 (2013.01); G01L 19/148 (2013.01); H01L 23/3157 (2013.01); H01L 24/13 (2013.01); H01L 24/45 (2013.01); H01L 2924/146 (2013.01);
Abstract
A semiconductor device includes a base substrate, a detection device provided on the base substrate and including a detector, a first connector electrically connecting the base substrate and the detection device, and a resin package provided on the base substrate and embedded with the detection device and the first connector. The resin package includes an exposure hole exposing the detector of the detection device to the outside, and a concave-convex portion.