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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11348862 B1

PDFFull Text
Date of Patent:
May. 31, 2022

Filed:

Sep. 04, 2020

Source electrode and connector lead with notched portions for a semiconductor package

Applicants:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;

Inventor:

Seiichi Kamiyama, Kanazawa Ishikawa, JP;

Assignees:

KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;

TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION, Tokyo, JP;

Attorney:

Kim & Stewart LLP

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/48 (2006.01); H01R 9/00 (2006.01); H05K 7/18 (2006.01); H01L 23/482 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49513 (2013.01); H01L 23/4824 (2013.01); H01L 23/49524 (2013.01); H01L 23/49541 (2013.01); H01L 23/49562 (2013.01); H01L 23/49838 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/83 (2013.01); H01L 24/84 (2013.01);
Abstract

Provided is a semiconductor device including: a semiconductor chip having a rectangular region including a first corner portion having a first notch portion, a second corner portion being provided to diagonally face the first corner portion, a third corner portion, and a fourth corner portion being provided to diagonally face the third corner portion on a surface and having a semiconductor element formed in the rectangular region; a first electrode including a fifth corner portion being provided on the first corner portion and having a second notch portion, a sixth corner portion being provided on the second corner portion, a seventh corner portion being provided on the third corner portion, and an eighth corner portion being provided on the fourth corner portion, the first electrode being provided on the semiconductor element, and the first electrode being electrically connected to the semiconductor element; and a first connector including a ninth corner portion being provided on the fifth corner portion and having a third notch portion and a twelfth corner portion being provided on the eighth corner portion, the first connector being provided on the first electrode, and the first connector being electrically connected to the first electrode.

Find Patent Forward Citations

Kamiyama, Seiichi. (2022). Source electrode and connector lead with notched portions for a semiconductor package (U.S. Patent No. 11348862). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11348862

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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