IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11348851 B1

PDFFull Text
Date of Patent:
May. 31, 2022

Filed:

Nov. 30, 2020

Case with a plurality of pair case components for a semiconductor device

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventor:

Yasutaka Shimizu, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/34 (2006.01); H01L 21/00 (2006.01); H05K 7/00 (2006.01); H05K 5/00 (2006.01); H01L 23/049 (2006.01); H01L 23/10 (2006.01); H01L 23/367 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H01L 23/055 (2006.01); H01L 23/053 (2006.01); B23K 3/047 (2006.01);
U.S. Cl.
CPC ...
H01L 23/049 (2013.01); B23K 3/047 (2013.01); H01L 21/4817 (2013.01); H01L 21/4871 (2013.01); H01L 21/565 (2013.01); H01L 23/053 (2013.01); H01L 23/055 (2013.01); H01L 23/10 (2013.01); H01L 23/3121 (2013.01); H01L 23/367 (2013.01); H01L 23/3735 (2013.01); H01L 23/48 (2013.01); H01L 2924/181 (2013.01);
Abstract

An object is to provide a technology for enabling reduction in the time and cost taken to manufacture a die to be used for molding a case that surrounds semiconductor elements. A semiconductor device includes a base plate, a cooling plate, an insulating substrate, a semiconductor element, a case, a lead frame formed integrally with the case and including a terminal formed on one end portion of the lead frame and protruding outward, and a sealant. The case includes a pair of first case components arranged to face each other, and a pair of second case components arranged to face each other and crossing the pair of first case components. Joining end portions of the first case components to end portions of the pair of second case components forms the case.

Find Patent Forward Citations

Loading…