The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2022

Filed:

Jul. 15, 2020
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Doyoung Kwag, Suwon-si, KR;

Byungchul Kim, Suwon-si, KR;

Sangmoo Park, Suwon-si, KR;

Minsub Oh, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); B23K 26/03 (2006.01); B23K 26/04 (2014.01); B23K 26/08 (2014.01); H01L 21/67 (2006.01); H01L 25/075 (2006.01); H01L 27/12 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); B23K 26/03 (2013.01); B23K 26/0344 (2015.10); B23K 26/048 (2013.01); B23K 26/0861 (2013.01); H01L 21/67144 (2013.01); H01L 25/0753 (2013.01); H01L 27/1214 (2013.01); H01L 33/62 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68381 (2013.01); H01L 2933/0066 (2013.01);
Abstract

The application is related to a laser transfer apparatus and a method performed by the laser transfer apparatus. The laser transfer apparatus may include: a laser oscillator configured to perform irradiation with a laser beam; a first stage movably disposed below the laser oscillator; a second stage movably disposed below the first stage; a flatness measurement sensor; and a controller. The controller may be configured to control, once a transfer substrate on which a plurality of light emitting diodes (LEDs) are arranged is loaded on the first stage, and a target substrate is loaded on the second stage, the flatness measurement sensor to measure flatness of each of the transfer substrate and the target substrate, and adjust a height of at least one of the first stage or the second stage based on the flatness.


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