The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2022
Filed:
Dec. 23, 2014
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Lee Han Meng@ Eugene Lee, Johor, MY;
Shu Hui Ooi, Kedah, MY;
Anis Fauzi Abdul Aziz, Kedah, MY;
Wei Fen Sueann Lim, Melaka, MY;
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); C25D 7/00 (2006.01); C25D 17/08 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); C25D 5/02 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4821 (2013.01); C25D 7/00 (2013.01); C25D 17/08 (2013.01); H01L 23/49582 (2013.01); H01L 24/97 (2013.01); C25D 5/022 (2013.01); H01L 21/561 (2013.01); H01L 23/3107 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/181 (2013.01);
Abstract
A method of making Flat No-Lead Packages with plated lead surfaces exposed on lateral faces thereof. The method includes providing a plurality of Flat No-Lead Packages having severed, unplated lead surfaces exposed on lateral faces thereof and having plated lead surfaces exposed on bottom faces thereof. The method further includes batch electroplating the severed unplated lead surfaces of the plurality of Flat No-Lead Packages.