IDiyas

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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11348729 B1

PDFFull Text
Date of Patent:
May. 31, 2022

Filed:

Apr. 07, 2020

Dielectric composition and multilayer electronic component including the same

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Jae Sung Park, Suwon-si, KR;

Hyoung Uk Kim, Suwon-si, KR;

Hyung Soon Kwon, Suwon-si, KR;

Jong Han Kim, Suwon-si, KR;

Jeong Ryeol Kim, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;

Attorney:

Morgan, Lewis & Bockius LLP

Primary Examiner:

Karl E Group

Assistant Examiner:

Cameron K Miller

Int. Cl.
CPC ...
H01G 4/12 (2006.01); H01G 4/30 (2006.01); H01G 4/012 (2006.01); H01G 4/248 (2006.01); C04B 35/468 (2006.01); C04B 35/626 (2006.01); C04B 35/638 (2006.01); C04B 35/64 (2006.01); H01B 3/02 (2006.01); H01B 3/10 (2006.01);
U.S. Cl.
CPC ...
H01G 4/1209 (2013.01); C04B 35/4682 (2013.01); C04B 35/6264 (2013.01); C04B 35/638 (2013.01); C04B 35/64 (2013.01); H01B 3/02 (2013.01); H01B 3/10 (2013.01); H01G 4/012 (2013.01); H01G 4/1218 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3215 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/3224 (2013.01); C04B 2235/3236 (2013.01); C04B 2235/3244 (2013.01); C04B 2235/3418 (2013.01); C04B 2235/36 (2013.01); C04B 2235/442 (2013.01); C04B 2235/6025 (2013.01); C04B 2235/656 (2013.01); C04B 2235/6582 (2013.01); C04B 2235/781 (2013.01); C04B 2235/785 (2013.01);
Abstract

A dielectric composition includes one of BaTiO, (Ba,Ca) (Ti,Ca)O, (Ba,Ca) (Ti,Zr)O, Ba(Ti,Zr)Oand (Ba,Ca) (Ti,Sn)O, as a main component, a first subcomponent including a rare earth element, and a second subcomponent including at least one of a variable valence acceptor element and a fixed valence acceptor element. When a sum of contents of the rare earth element is defined as DT and a sum of contents of the variable valence acceptor element and the fixed valence acceptor element is defined as AT, (DT/AT)/(Ba+Ca) satisfies more than 0.5 and less than 6.0. In addition, a multilayer electronic component including the dielectric composition is provided.

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